introduction

YC-60 is a substitution type electroless gold plating specially designed for the benefit of SMT and chip packaging, and it is also immersed in gold

When the thickness is less than or equal to 0.06um, the coating performance is the best. Therefore, before gold plating, a sufficient nickel deposition is carried out on the substrate

It is necessary (4μm or more is preferred). For this purpose, we recommend using YC-51/51-1 series as chemical nickel

The solution.