introduction

YC-65 is a semi-replacement type electroless gold immersion plating, suitable for semiconductors, printed circuit boards and connectors

The electroless nickel gold process, and the general electronic components electroless gold process. The process principle is the application of ion electricity

The position change method and immersion plating can produce a 0.4µm (15µinch) chemical gold layer on nickel. Generally also used in

Pre-gold plating treatment before reduction electroless gold. This electroless nickel gold process does not contain sulfur and its compounds to extend

Protect the service life of reduced electroless gold.