introduction

YC-582 is a displacement chemical palladium plating solution with excellent plating uniformity. It is mainly used for chemical palladium layers below 2μinch. Its plating can meet the reliability of soldering in the circuit board SMT process. It is suitable for improving the original ENIG and Bonding process performance, no hidden dangers of black pad, and under the trend of lead-free process, improved quality assurance, showing great advantages. Therefore, before palladium plating, sufficient nickel (4μm or more is preferred) is deposited on the substrate. For this purpose, we recommend using YC-51/51-1 series as the electroless nickel plating solution.