introduction

YC-58 In order to meet the reliability of soldering in the circuit board SMT process, it is suitable for improving the original

ENIG and Bonding process performance, there is no hidden danger of black pad, and under the trend of lead-free process, improved

Quality assurance shows great advantages. Therefore, before palladium plating, sufficient nickel (4μm

The above is better) deposition. For this purpose, we recommend using YC-51/51-1 series as the electroless nickel plating solution.